Lens driving device, and camera module and optical instrument comprising same

ABSTRACT

An embodiment comprises: a housing a bobbin disposed inside the housing, and having a lens disposed thereon; a first coil disposed at the outer circumferential surface of the bobbin; a first magnet disposed at a size part of the housing in correspondence to the first coil; a first position sensor disposed in the bobbin, and including first and second input terminals and first and second output terminals; a circuit board including first and second terminals electrically connected to the first and second output terminals of the first position sensor; and a capacitor connected in parallel to the first and second terminals of the circuit board so as to remove noise from the output of the first position sensor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/848,054, filed Apr. 14, 2020; which is a continuation of U.S.application Ser. No. 15/772,378, filed Apr. 30, 2018, now U.S. Pat. No.10,656,374, issued May 19, 2020; which is the U.S. national stageapplication of International Patent Application No. PCT/KR2016/012206,filed Oct. 28, 2016, which claims priority to Korean Patent ApplicationNo. 10-2015-0153120, filed Nov. 2, 2015, the disclosures of each ofwhich are incorporated herein by reference in their entirety.

TECHNICAL FIELD

An embodiment relates to a lens drive unit, camera module including thesame and optical instrument including the same.

BACKGROUND ART

As it is difficult to apply the technology of a voice coil motor (VCM)used for an existing general camera module to a subminiature cameramodule for low power consumption, many ongoing efforts are made toresearch and develop the subminiature camera module for low powerconsumption.

Regarding a camera module mounted on a compact electronic product suchas a smartphone, impact may be frequently made on the camera module inthe course of using such a product and the camera module may be minutelyunstable due to user's hand shaking and the like during photographing.Considering such problems, many ongoing efforts are made to research anddevelop a technique of additionally installing a destabilizationinhibiting means in a camera module.

DISCLOSURE OF THE INVENTION Technical Task

The technical task of an embodiment is to provide a lens drive unit,camera module and optical instrument, by which noise due to crosstalkwith a first coil is eliminated as well as feedback closed-loopperformance of a first position sensor is improved.

Technical Solutions

In one technical aspect of an embodiment, provided herein is a lensdrive unit, including a housing, a bobbin disposed within the housing soas to have a lens disposed therein, a first coil disposed on an outercircumference of the bobbin, a first magnet disposed on a lateralportion of the housing so as to correspond to the first coil, a firstposition sensor disposed on the bobbin, the first position sensorincluding first and second input terminals and first and second outputterminals, a circuit board including first and second terminalselectrically connected to the first and second output terminals of thefirst position sensor, and a capacitor connected in parallel to thefirst and second terminals of the circuit board to eliminate noise froman output of the first position sensor.

The circuit board may include a first wiring electrically connecting thefirst output terminal of the first position sensor to the first terminaland a second wiring electrically connecting the second output terminalof the first position sensor to the second terminal, one end of thecapacitor may be connected to the first wiring, and the other end of thecapacitor may be connected to the second wiring.

The capacitor may include a first conductive layer, a second conductivelayer, and a first insulating layer disposed between the first andsecond conductive layers, and the first conductive layer, the secondconductive layer and the insulating layer may be disposed in the circuitboard. The lens drive unit may further include a resistor connectedbetween one end of the capacitor and one of the first and second outputterminals of the first position sensor.

The circuit board may further include third and fourth terminalselectrically connected to the first and second input terminals of thefirst position sensor, a drive signal may be provided to the firstposition sensor via the third and fourth terminals, and an output signalof the first position sensor may be outputted via the first and secondterminals.

The lens drive unit may further include an upper elastic member and alower elastic member joined to the bobbin and the housing and a supportmember electrically connecting the upper elastic member and the circuitboard, the first and second output terminals of the first positionsensor may be electrically connected to the upper elastic member, andthe support member may be electrically connected to the first wiring andthe second wiring.

Capacitance of the capacitor may be 10 nF 50 nF.

The first position sensor may include an internal resistor andresistance of the internal resistor of the first position sensor may be500 ohm (Ω)˜1000 ohm (Ω).

The lens drive unit may further include a second coil disposed on thecircuit board, a base disposed under the circuit board, and a secondposition sensor sensing strength of a magnetic field of the magnetaccording to a movement of the housing.

A drive signal including a PWM (pulse width modulation) signal may beapplied to the first coil.

The lens drive unit may further include a sensor board disposed on thebobbin, the sensor board may include first and second elastic membercontact portions electrically connected to the first and second outputterminals of the first position sensor, the first and second elasticmember contact portions may be electrically connected to the upperelastic member, and the capacitor may be disposed on the sensor boardand connected in parallel to the first and second elastic member contactportions of the sensor board.

In another technical aspect of an embodiment, provided herein is acamera module, including a lens barrel, the aforementioned lens driveunit moving the lens barrel, an image sensor transforming an imageincident through the lens drive unit into an electrical signal, and afirst controller connected to the first and second terminals of thecircuit board, the first controller including an amplifier amplifying anoutput signal of the first position sensor.

In another technical aspect of an embodiment, provided herein is acamera module, including a lens drive unit moving a lens barrel, animage sensor transforming an image incident through the lens drive unitinto an electrical signal, a holder having the image sensor disposedthereon, and a first controller controlling the lens drive unit, thelens drive unit, including a housing, a bobbin disposed within thehousing so as to have a lens disposed therein, a first coil disposed onan outer circumference of the bobbin, a first magnet disposed on alateral portion of the housing so as to correspond to the first coil, afirst position sensor disposed on the bobbin, the first position sensorincluding first and second input terminals and first and second outputterminals, a circuit board including first and second terminalselectrically connected to the first and second output terminals of thefirst position sensor, and a capacitor connected in parallel to thefirst and second terminals of the circuit board to eliminate noise froman output of the first position sensor.

The first controller may include an amplifier including first and secondinput terminals connected to the first and second terminals of thecircuit board and an output terminal outputting an amplified signalaccording to a result from amplifying an output signal of the firstposition sensor, and the capacitor may be connected in parallel to thefirst and second terminals of the circuit board and the first and secondinput terminals of the amplifier.

The holder may include third and fourth wirings connecting the first andsecond terminals of the circuit board to the first and second inputterminals of the amplifier, one end of the capacitor may be connected tothe third wiring, and the other end of the capacitor may be connected tothe fourth wiring.

Capacitance of the capacitor may be 10 nF 50 nF. The first positionsensor may include an internal resistor and resistance of the internalresistor of the first position sensor may be 500 ohm (Ω)˜1000 ohm (Ω).

The circuit board may include third and fourth terminals electricallyconnected to the first and second input terminals of the first positionsensor, a drive signal may be provided to the first position sensor viathe third and fourth terminals, and an output signal of the firstposition sensor may be outputted via the first and second terminals.

The drive signal provided to the first position sensor may be a PWM(pulse width modulation) signal and a frequency of the PWM signal may be0.1 MHz˜10 MHz.

In further technical aspect of an embodiment, provided herein is anoptical instrument, including a display module including a plurality ofpixels changing in color by an electrical signal, the aforementionedcamera module transforming an image incident through a lens into anelectrical signal, and a second controller controlling the displaymodule and the camera module.

Advantageous Effects

According to an embodiment, noise due to crosstalk with a first coil canbe eliminated and feedback closed-loop performance of a first positionsensor can be improved.

DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective diagram of a lens drive unit according to anembodiment.

FIG. 2 is an exploded perspective diagram of the lens drive unit shownin FIG. 1.

FIG. 3 is an assembled perspective diagram of a lens drive unit fromwhich a cover member shown in FIG. 1 is removed.

FIG. 4 is an exploded perspective diagram of a bobbin, first coil, firstmagnet, second magnet, first position sensor and sensor board shown inFIG. 1.

FIG. 5A is a layout of the bobbin and first magnet shown in FIG. 4.

FIG. 5B is a disassembled perspective diagram of the sensor board andfirst position sensor shown in FIG. 4.

FIG. 5C is a rear perspective diagram of the sensor board shown in FIG.4 according to one embodiment.

FIG. 6 is a front perspective diagram of a housing shown in FIG. 1.

FIG. 7 is a rear exploded perspective diagram of a housing, secondmagnet and first magnet shown in FIG. 1.

FIG. 8 is a cross-sectional diagram along a cutting line I-I′ shown inFIG. 3.

FIG. 9 is a rear assembled perspective diagram of a bobbin, housing,lower elastic member and plural support members shown in FIG. 1.

FIG. 10 is an assembled perspective diagram of an upper elastic member,lower elastic member, first position sensor, sensor board, base, supportmember and circuit board shown in FIG. 1.

FIG. 11 is an exploded diagram of a base, second coil, circuit board andcapacitor shown in FIG. 1.

FIG. 12 shows a capacitor mounted on a circuit board.

FIG. 13 is a circuit diagram showing electrical connection between acapacitor and a first position sensor.

FIG. 14 shows electrical connection relations between a capacitor andterminals of a circuit board.

FIG. 15 shows electric connection relations among a first positionsensor, capacitor and resistor according to another embodiment.

FIG. 16 is an exploded perspective diagram of a camera module accordingto an embodiment.

FIG. 17 shows one embodiment of connection relations among a firstposition sensor, second position sensor, capacitors and optical imagestabilization controller of the camera module shown in FIG. 16.

FIG. 18 is an exploded perspective diagram of a camera module accordingto another embodiment.

FIG. 19 shows one embodiment of a filter unit shown in FIG. 18.

FIG. 20 shows one embodiment of connection relations among a firstposition sensor, second position sensor, capacitors and optical imagestabilization control unit of the camera module shown in FIG. 18.

FIG. 21 is a block diagram of an image sensor shown in FIG. 16 and FIG.18 according to one embodiment.

FIG. 22 is a perspective diagram of a portable terminal according to anembodiment.

FIG. 23 is a configurational diagram of the portable terminal shown inFIG. 22.

BEST MODE FOR INVENTION

Reference will now be made in detail to the preferred embodiments,examples of which are illustrated in the accompanying drawings. In thefollowing description of an embodiment, when layers (films), regions,patterns or structures are formed ‘over/on’ or ‘below/under’ asubstrate, layers (films), region, pads or patterns, ‘over/on’ and‘below/under’ include the meaning of forming ‘directly’ or ‘by insertinganother layer (indirectly’. Moreover, criteria of ‘over/on’ and‘below/under’ shall be described with reference to the drawings.

For clarity and convenience of description, a size in the drawing isexaggerated, omitted or illustrated schematically. A size of eachcomponent may not reflect a real size completely. The same referencenumber indicates the same element through the description of thedrawing.

A lens drive unit according to an embodiment is described with referenceto the accompanying drawing as follows. For clarity of the description,a lens drive unit according to an embodiment is described usingCartesian coordinate system (x, y, z) and other coordinate systems areusable, by which the embodiment if non-limited. In each drawing, x-axisand y-axis mean directions vertical to z-axis that is an optical axis,respectively, a z-axis direction that is an optical axis direction maybe named a first direction, an x-axis direction may be named a seconddirection, and a y-axis direction may be named a third direction.

An ‘optical image stabilization device’ applied to a compact cameramodule of a mobile device such as a smartphone, a tablet PC, or the likemay means a device configured to inhibit an outline of a shot image frombeing blurred due to vibration generated from user's hand shaking incase of photographing a still picture.

An ‘autofocusing device’ is a device that automatically images a focusof a picture of a subject on an image sensor surface. The optical imagestabilization device and the autofocusing device can be configured invarious ways. A lens drive unit according to an embodiment can performsan optical image stabilization operation and/or an autofocusingoperation in a manner of moving an optical module configured with atleast one lens in a first direction parallel to an optical axis ormoving the optical module for a plane formed by second and thirddirections vertical to the first direction.

FIG. 1 is a perspective diagram of a lens drive unit 100 according to anembodiment. FIG. 2 is an exploded perspective diagram of the lens driveunit 100 shown in FIG. 1.

Referring to FIG. 1 and FIG. 2, a lens drive unit 100 includes a covermember 300, an upper elastic member 150, a sensor board 180, a firstposition sensor 170, a first coil 120, a bobbin 110, a housing 140, afirst magnet 130 (referred to as a moving magnet), a lower elasticmember 160, a circuit board 250, a base 210 and a capacitor 310.

The lens drive unit 100 may further include a second magnet 190(referred to as a sensing magnet).

The lens drive unit 100 may further include a plurality of supportmembers 220, a second coil 230, and second position sensors 240 (240 aand 240 b).

First of all, the cover member 300 is described.

The cover member 300 receives the upper elastic member 150, the bobbin110, the first coil 120, the housing 140, the second magnet 190, thefirst magnet, the lower elastic member 160, a plurality of the supportmembers 220, the second coil 230, the circuit board 250 and thecapacitor 310 in a receiving space formed with the base 210.

The cover member 300 may have a box shape including a top end portionand sidewalls by having an open bottom. A lower side of the cover member300 can be joined to a upper side of the base 210. A shape of the upperside of the cover member 300 may include a polygonal shape such asquadrangle, octagon, etc.

A hollow for exposing a lens (not shown) joined to the bobbin 110 toexternal light may be provided to the upper side of the cover member300. In order to inhibit particles (e.g., dust, moisture, etc.) frompenetrating into the camera module, a window formed of lighttransmissive material may be additionally provided to the hollow of thecover member 300.

The material of the cover member 300 may include nonmagnetic materialsuch as SUS or the like to inhibit the cover member 300 from sticking tothe first magnet 130, but be formed of magnetic material to play a roleas a yoke.

FIG. 3 is an assembled perspective diagram of the lens drive unit 100from which the cover member 300 shown in FIG. 1 is removed. FIG. 4 is anexploded perspective diagram of the bobbin 110, the first coil 120, thesecond magnet 190, the first magnet 130-1 to 130-4, the first positionsensor 170 and the sensor board 180 shown in FIG. 1.

The bobbin 110 is described as follows.

Referring to FIG. 3 and FIG. 4, the bobbin 110 is disposed inside thehousing 140, and is movable in an optical axis direction or a firstdirection, e.g., a z-axis direction owing to electromagnetic interactionbetween the first coil 120 and the first magnet 130.

The bobbin 110 may include a lens barrel (not shown) having at least onelens installed therein, and the lens barrel may be joined to an insideof the bobbin 110 in various ways [not shown].

The bobbin 110 may have a structure that includes a hollow for theinstallation of the lens or the lens barrel. A shape of the hollow mayinclude a circle, an oval, or a polygon, by which the shape isnon-limited.

The bobbin 110 may include a first protrusion 111 and a secondprotrusion 112.

The first protrusion 111 of the bobbin 110 may include a guide portion111 a and a first stopper 111 b.

The guide portion 111 a of the bobbin 110 may play a role in guiding aninstallation location of the upper elastic member 150. For example, asshown in FIG. 3, the guide portion 111 a of the bobbin 110 can guide apath for a first frame connecting portion 153 of the upper elasticmember 150 to pass through.

For example, a plurality of the guide portions 111 a may be formed in amanner of protruding in the second and third directions vertical to thefirst direction. Moreover, as shown in the example, the guide portion111 a may have a structure symmetric with respect to the center of thebobbin 110 in the plane formed by the x-axis and the y-axis, or anasymmetric structure in which interference with other parts is excludedunlike the example.

The second protrusion 112 of the bobbin 110 may be formed in a manner ofprotruding in the second and third directions vertical to the firstdirection. And, an upper surface 112 a of the second protrusion 112 ofthe bobbin 110 may have a shape to enable a first inner frame 151 of theupper elastic member 150 to be seated thereon.

When the bobbin 110 moves in the first direction parallel to the opticalaxis or a direction parallel to the first direction for the autofocusingfunction, although the bobbin 110 moves over a prescribed range due toexternal shock or the like, the first stopper 111 b of the firstprotrusion 111 and the second protrusion 112 in the bobbin 110 can playa role in inhibiting a body lower surface of the bobbin 110 fromdirectly colliding with an upper surface of the circuit board 250. Thebobbin 110 may include a support recess 114 provided between an innercircumference 110 a and an outer circumference 110 b of the bobbin 110so as to enable the sensor board 180 to be inserted in the firstdirection (e.g., z-axis direction). For example, the support recess 114of the bobbin 110 may be provided between the inner circumference 110 aand the first and second protrusions 111 and 112 of the bobbin 110 so asto be inserted in the first direction (e.g., z-axis direction) of thesensor board 180. The support recess 114 may have a shape matching thatof the sensor board 180. For example, the support recess 114 may have aring shape, by which the embodiment is non-limited.

The bobbin 110 may include a recess 116 in which the first positionsensor 170 disposed, joined or mounted on the sensor board 180 isreceived or disposed.

For example, the bobbin 110 may include the recess 116 provided to aspace between the first and second protrusions 111 and 112 so as toenable the first position sensor 170 mounted on the sensor board 180 tobe inserted in the first direction.

The bobbin 110 may have a support projection 117 (cf. FIG. 8) joined andfixed to the lower elastic member 160.

If a state that lower surfaces of the first and second protrusions 111and 112 come in contact with a floor surface 146 a of a first seatrecess 146 of the housing 140 is set as an initial position of an AFmoving unit, autofocusing of the lens drive unit 100 according to anembodiment enables a uni-directional control of a voice coil motor(VCM). Namely, when a drive signal, e.g., a drive current is supplied tothe first coil 120, the bobbin 110 ascends. When the supply of the drivecurrent is cut off, the bobbin 120 descends. Thus, the autofocusingfunction can be implemented.

Yet, if a location of the floor surface 146 a of the first seat recess146 is spaced apart by a predetermined distance from the lower surfacesof the first and second protrusions 111 and 112 is set as an initialposition of the AF moving unit, autofocusing of the lens drive unit 100according to an embodiment enables bi-directional control of the voicecoil motor. Namely, the bobbin 110 can be controlled to move up or downin the first direction at the initial position of the AF moving unit.For example, if a forward drive current is applied to the first coil120, the bobbin 110 can move up. If a reverse drive current is appliedto the first coil 120, the bobbin 110 can move down.

For instance, the AF moving unit can include the bobbin 110 and thecomponents (e.g., first coil 120, first position sensor 170, sensorboard 180, etc.) jointed to the bobbin 110. Moreover, the initialposition of the AF moving unit may include an initial position of thebobbin 110 in a state that power is not applied to the first coil 120 ora position at which the AF moving unit is located as the top and lowerelastic members 150 and 150 are elastically deformed by weight of the AFmoving unit only.

The first coil 120 is described as follows.

The first coil 120 is disposed on the outer circumference 110 a (cf.FIG. 4) of the bobbin 110.

For example, at the initial position of the AF moving unit (or, thebobbin 110), the first coil 120 can be disposed so as not to overlapwith the first position sensor 170 in the second or third directionvertical to the first direction.

The first coil 120 and the first position sensor 170 can be disposed onan outer circumference 110 a of the bobbin 110 by being spaced apartfrom each other so as not to interfere or overlap with each other in thesecond or third direction. For example, the first coil 120 may bedisposed on a lower side or part of the outer circumference 110 a of thebobbin 110 and the first position sensor 170 may be disposed over thefirst coil 120 by being spaced apart from the first coil 120.

The first coil 120 may be disposed or wound, as shown in FIG. 4, in adirection of rotating centering on the optical axis so as to enclose theouter circumference 110 a of the bobbin 110.

The first coil 120 may be inserted, disposed, or fixed within a recessportion 118 (cf. 8) formed on the outer circumference 110 a of thebobbin 110.

In FIG. 4, the first coil 120 may be directly disposed or wound on theouter circumference 110 a of the bobbin 110, by which the presentembodiment is non-limited. According to anther embodiment, the firstcoil 120 may be a coil ring type or include a coil block in an angulatering shape. Here, the coil ring may be joined to the bobbin 110 in thesame manner as the sensor board 180 is fixed by being fitted into therecess 114 of the bobbin 110.

The first coil 120, as shown in FIG. 2, may be formed in anapproximately octagonal shape. Such a shape of the first coil 120corresponds to a shape of the outer circumference of the bobbin 110.This is because the outer circumference of the bobbin 110, as shown inFIG. 5A, has an octagonal shape.

Moreover, at least 4 faces may be straight-lined and corners connectingsuch faces may be straight-lined as well, by which the embodiment isnon-limited. Such faces and corners may be rounded.

A drive signal of an AC (alternate current) signal (e.g., alternatecurrent) can be applied to the first coil 120 for AF drive. For example,a drive signal of the first coil 120 may include a sinusoidal signal ora pulse signal (e.g., PWM (pulse width modulation) signal).

According to another embodiment, drive signals applied to the first coil120 may include an AC signal and a DC signal. For example, a frequencyof a PWM signal may be equal to or greater than 20 KHz, or equal to orgreater than 500 KHz for reduction of power consumption. For example, afrequency of a PWM signal may be 0.1 MHz˜10 MHz.

If supplied with a drive signal, the first coil 120 can generate anelectromagnetic force through electromagnetic interaction with the firstmagnet 130, and the generated electromagnetic force can move the bobbin110 in the first direction.

The first coil 120 may be configured to correspond to the first magnet130. As the first magnet 130 is configured as a single body, if a wholeface confronting the first coil 120 is prepared as having the samepolarity, a face of the first coil 120 corresponding to the first magnet130 can be configured to have the same polarity as well. For example,current can flow in the same direction through the face of the firstcoil 120 corresponding to the first magnet 130.

As the first magnet 130 is partitioned into 2 or 4 parts as a facevertical to the optical axis, if a face confronting the first coil 120is divided into two or more faces, the first coil 120 can be partitionedinto parts of which number corresponds to the number of the partitionedfirst magnets 130 as well.

The first position sensor 170 and the sensor board 180 are described asfollows.

The first position sensor 170 can be moved together with the bobbin 110by being disposed, joined or mounted on the bobbin 110.

When the bobbin 110 110 moves in the optical axis direction, the firstposition sensor 170 can be moved together with the bobbin 110.

In case of an embodiment from which the second magnet 190 is omitted,the first position sensor 170 can sense the strength of a magnetic fieldof the first magnet 130 according to the movement of the bobbin 110, andis able to generate an output or sensing signal according to a result ofthe sensing.

In case of an embodiment having the first and second magnets 130 and 190included therein, the first position sensor 170 can sense a sum of thestrength of a magnetic field of the first magnet 130 and the strength ofa magnetic field of the second magnet 190, and is able to generate anoutput or sensing signal according to a result of the sensing. Using theoutput signal of the first position sensor 170, displacement in theoptical direction of the bobbin 110 or the first direction can beadjusted.

The first position sensor 170 can be electrically connected to thesensor board 180. The first position sensor 170 may be embodied as adriver type including a hall sensor, or may be independently embodied bya position detection sensor such as a hall sensor or the like.

The first position sensor 170 may be disposed, joined or mounted on thebobbin 110 in various forms. And, a drive signal can be applied to thefirst position sensor 170 according to a disposed, joined or mountedtype of the first position sensor 170.

The first position sensor 170 may be disposed, joined or mounted on theouter circumference 110 a of the bobbin 110.

For example, the first position sensor 170 may be disposed, joined ormounted on the sensor board 180. The sensor board 180 may be disposed,joined or mounted on the outer circumference 110 a of the bobbin 110.Namely, the first position sensor 170 can be indirectly disposed, joinedor mounted on the bobbin 110 through the sensor board 180.

The first position sensor 170 can be electrically connected to at leastone of the upper elastic member 150 and the lower elastic member 160.For example, the sensor board 180 electrically connected with the firstposition sensor 170 can be electrically connected to at least one of theupper elastic member 150 and the lower elastic member 160. For example,the first position sensor 170 may be electrically connected to the upperelastic member 150.

FIG. 5A is a layout of the bobbin 110 and first magnet 130 (130-1 to130-4) shown in FIG. 4. FIG. 5B is a disassembled perspective diagram ofthe sensor board 180 and first position sensor 170 shown in FIG. 4. FIG.5C is a rear perspective diagram of the sensor board 180 shown in FIG. 4according to one embodiment.

Referring to FIG. 4 and FIG. 5A, the sensor board 180 is mounted on thebobbin 110 and can be moved together with the bobbin 110 in the opticaldirection or the first direction.

For example, the sensor board 180 can be joined to the bobbin 110 bybeing inserted or disposed in the recess 114 of the bobbin 110. Thesensor board 180 is enough to be mounted on the bobbin 110. A ring shapeof the sensor board 180 is exemplarily shown in FIG. 4, by which theembodiment is non-limited.

The first position sensor 170 can be supported by being attached to afront or upper side of the sensor board 180 using such an adhesivemember as epoxy, double-sided tape, etc.

The outer circumference 110 a of the bobbin 110 may include firstlateral sides S1 corresponding to first lateral portions 141 of thehousing 140, on which the first magnet 130 is disposed, and secondlateral sides S2 disposed between the first lateral sides S1 so as toconnect the first lateral sides S1 to each other.

The first position sensor 170 may be disposed on one of the firstlateral sides S1 of the bobbin 110. For example, the recess 116 of thebobbin 110 may be provided to one of the first lateral sides S1 of thebobbin 110, and the first position sensor 170 can be inserted ordisposed in the recess 116 of the bobbin 110. According to anotherembodiment, the first position sensor 170 may be disposed on one of thesecond lateral sides S2 of the bobbin 110.

Referring to FIG. 5B, the first position sensor 170 may be disposed,joined or mounted on one surface of the sensor board 180.

For example, the first position sensor 170 may be disposed on onesurface of the sensor broad 180 so as to be located or aligned in aspace between the first and second magnets 130 and 190 in the firstdirection at the AF moving unit, e.g., an initial position of the bobbin110.

The first position sensor 170 can be electrically connected to wiringsor circuit patterns L1 to L4 (cf. FIG. 5C) provided to the sensor board180. And a drive signal can be externally applied to the first positionsensor 170 through the sensor board 180.

The first position sensor 170 can be disposed on an upper part of oneside of the sensor board 180 in order to be located distant from thefirst coil 120 disposed under the outer circumference 110 a of thebobbin 110 as far as possible, whereby an effect of a magnetic fieldattributed to a drive signal applied to the first coil 120 is suppressedor relieved in a high frequency range. Thus, malfunction and error ofthe first position sensor 170 can be inhibited.

The sensor board 180 may include a body 182, elastic member contactportions 184-1 to 184-4 and circuit patterns L1 to L4. For example, thecircuit patterns L1 to L4 may include wirings.

If the recess of the bobbin 110 has the same shape of the outercircumference 110 a of the bobbin 110, the body 182 of the sensor board180 inserted in the recess 114 of the bobbin 110 may have a shapecapable of being inserted in and fixed to the recess 114.

As shown in FIGS. 3 to 5A, each of the recess 114 of the bobbin 110 andthe body 182 of the sensor board 180 may have a shape of a circularplane, by which the embodiment is non-limited. According to anotherembodiment, each of the recess 114 of the bobbin 110 and the body 182 ofthe sensor board 180 may have a shape of a polygonal plane.

Referring to FIG. 5B, the body 812 of the sensor board 180 may include afirst segment 182 a having the first position sensor 170 disposed,joined or mounted thereon and a second segment 182 b extending by beingadjacent to the first segment 182 a so as to be inserted in the recess114 of the bobbin 110.

An opening 181 is provided to a portion of the sensor board 180confronting the first segment 182 a so as to facilitate the sensor board180 to be inserted in the recess 114 of the bobbin 110. And, theembodiment is non-limited by a specific shape of the sensor board 180.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 can protrude from the body 182 of the sensor board 180, e.g., thesecond segment 182 b in a direction contactable with the first innerframe 151, e.g., the optical axis direction or the first direction.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may include a part to be connected or bonded to the first innerframe 151 of the upper elastic member 150. And, the number of theelastic member contact portions 184-1 to 184-4 may amount to 1 or more.

The circuit patterns L1 to L4 of the sensor board 180 are formed on thebody 182 of the sensor board 180 and can electrically connect the firstposition sensor 170 to the elastic member contact portions 184-1 to184-4.

For example, the first position sensor 170 may be provided as a hallsensor and employ any sensors capable of sensing strength of a magneticfield. If the first position sensor 170 is embodied by a hall sensor,the hall sensor may have a plurality of pins.

For example, a plurality of the pins may include input pins P11 and P12and output pins P21 and P22. Signals outputted through the output pinsP21 and P22 may be current or voltage types.

The input pins P11 and P12 and the output pins P21 and P22 of the firstposition sensor 170 can be electrically connected to the elastic membercontact portions 184-1 to 184-4 through the circuit patterns L1 to L4,respectively.

For example, referring to FIG. 5C, the circuit patterns may include aplurality of lines L1 to L4. For example, a plurality of lines and aline may be referred to as a plurality of wirings and a wiring,respectively.

One end of each of a plurality of lines L1 to L4 may be connected orbonded to a prescribed one of the input pins P11 and P12 and the outputpins P21 and P22 of the first position sensor 170. The other end of eachof a plurality of lines L1 to L4 may be connected or bonded to aprescribed one of the elastic member contact portions 184-1 to 184-2 ofthe sensor board 180.

For example, the first line L1 of the circuit pattern can electricallyconnect the first input pin P11 and the fourth elastic member contactportion 184-4, the second line L2 of the circuit pattern canelectrically connect the second input pin P12 and the third elasticmember contact portion 184-3, the third line L3 of the circuit patterncan electrically connect the first output pin P21 and the first elasticmember contact portion 184-1, and the fourth line L4 of the circuitpattern can electrically connect the second output pin P22 and thesecond elastic member contact portion 184-2.

According to one embodiment, the first to fourth lines L1 to L4 may beformed on a surface of the body 182 of the sensor board 180 so as to bevisible to the naked eyes. According to another embodiment, the first tofourth lines L1 to L4 may be formed within the body 182 of the sensorboard 180 so as to be invisible to the naked eyes.

The housing 140 is described as follows.

The housing 140 supports the second magnet 190 for sensing and the firstmagnet 130 for driving, and is able to receive the bobbin 110 inside soas to enable the bobbin 110 to move in the first direction parallel tothe optical axis.

The housing 140 may have a hollow pillar shape overall. For example, thehousing 140 may include a polygonal (e.g., tetragonal, octagonal) orcircular hollow.

FIG. 6 is a front perspective diagram of the housing 140 shown inFIG. 1. FIG. 7 is a rear exploded perspective diagram of the housing140, the second magnet 190 and the first magnet 130 shown in FIG. 1.FIG. 8 is a cross-sectional diagram along a cutting line I-I′ shown inFIG. 3. FIG. 9 is a rear assembled perspective diagram of the bobbin110, the housing 140, the lower elastic member 160 and the pluralsupport members 220 shown in FIG. 1.

The housing 140 may have a first seat recess 146 formed at a locationcorresponding to the first and second protrusions 111 and 112 of thebobbin 110.

The housing 140 may have a third protrusion 148 corresponding to a spacehaving a first width W1 between the first and second protrusions 111 and112 of the bobbin 110.

A face of the third protrusion 148 of the housing 140 confronting thebobbin 110 may have the same shape of a lateral part of the bobbin 110.In this case, the first width W1 between the first and secondprotrusions 111 and 112 of the bobbin and a second width W2 of the thirdprotrusion 148 of the housing 140 shown in FIG. 6 may have apredetermined tolerance. Thus, it is able to regulate the rotation ofthe third protrusion 148 of the housing 140 between the first and secondprotrusions 111 and 112 of the bobbin 110. If so, although the bobbin110 receives a force not in the optical axis direction but in adirection of rotation centering on an optical axis, the third protrusion148 of the housing 140 can inhibit the rotation of the bobbin 110.

For example, a upper side of an outer shell of the housing 140 has ashape of a quadrangular plane but a lower side of an inner shell of thehousing 140, as shown in FIG. 6 and FIG. 7, may have a shape of anoctagonal plane.

The housing 140 may include a plurality of lateral portions. Forexample, the housing 140 may include 4 first lateral portions 141 and 4second lateral portions 142. Each of the second lateral portions 142 maybe located between the 2 first lateral portions 141 adjacent to eachother. Each of the first lateral portions 141 may be a portioncorresponding to a side of the housing 140. Each of the second lateralportions 142 may be a portion corresponding to a corner of the housing140.

A width or length of a side of each of the first lateral portions 141may be greater than that of each of the second lateral portions 142.

For example, the first magnet 130 may be installed or disposed on thefirst lateral portions 142 of the housing 140. A support member 220 maybe disposed on the second lateral portions 142 of the housing 140. Thefirst lateral portions 141 of the housing 140 connect the second lateralportions 142 of the housing 140 mutually, and may include a plane to apredetermined depth.

Each of the first lateral portions 141 of the housing 140 may have anarea equal to or greater than an area of the corresponding first magnet130.

The housing 140 may include a first seat portion 141 b for receiving thesecond magnet 190 and a second seat portion 141 a for receiving thefirst magnets 130-1 to 130-4.

For example, the housing 140 may have the first seat portion 141 bprovided to an outer top end of one of the first lateral portions 141and a second seat portion 141 a provided to an inner bottom end of eachof the first lateral portions 141.

The first seat portion 141 b may be located over the second seat portion141 a.

The second magnet 190 may be inserted and fixed to the first seatportion 141 b, and each of the second magnets 130-1 to 130-4 can beinserted and fixed to the second seat portion 141 a provided to aprescribed one of the first lateral portions 141 of the housing 140.

The second seat portion 141 a of the housing 140 may be formed as aconcave recess corresponding to a size of the first magnet 130 anddisposed in a manner of confronting at least 3 faces (i.e., upper sideand both lateral sides) of the first magnet 130.

An opening may be formed on a lower side (i.e., a face confronting thesecond coil 230 mentioned later) of the second seat portion 141 a of thehousing 140. And, a lower side of the second magnet 130 fixed to thesecond seat portion 141 a can directly confront the second coil 230.

The first and second magnets 130 and 190 can be fixed to the first andsecond seat portions 141 b and 141 a of the housing 140 by an adhesiveagent, by which the embodiment is non-limited. Instead, an adhesivemember such as a double-sided tape and the like may be usable.

Or, the first and second seat portions 141 b and 141 a of the housing140 may be formed as mounting holes for exposing/fitting portions of thefirst and second magnets 130 and 190 therethrough/therein instead of theconcave recesses shown in FIG. 6 and FIG. 7.

For example, the second magnet 190 may be located over one (e.g., 130-1)of the first magnets 130-1 to 130-4. The second magnet 190 may bedisposed by being spaced apart from the first magnet (e.g., 130-1). Aportion of the housing 140 may be disposed between the second magnet 190and the first magnet (e.g., 130-1).

The first lateral portion 141 of the housing 140 may be disposedparallel to a lateral panel of the cover member 300. The first lateralportion 141 of the housing 140 may have a face greater than that of thesecond lateral portion 142. The second lateral portion 142 of thehousing 140 can form a path for the support member 220 to pass through.A upper side of the second lateral portion 142 of the housing 140 mayinclude a perforated hole 147. The support member 220 can be connectedto the upper elastic member 150 by penetrating the perforated hole 147.

Moreover, in order to inhibit direct collision with an inner lateralside of the cover member 300 shown in FIG. 1, a second stopper 144 maybe provided to a upper side of the housing 140.

The housing 140 may include at least one top support projection 143provided to a upper side of the housing 140 for joining to the upperelastic member 150.

For example, the first top support projection 143 of the housing 140 maybe formed on the upper side of the housing 140 corresponding to thesecond lateral portion 142 of the housing 140, by which the embodimentis non-limited. According to another embodiment, the first top supportprojection may be provided to a upper side of each of the first lateralportions of the housing 140.

The first top support projection 143 of the housing 140, as shown in thedrawing, may have a hemispherical shape or a cylindrical or prismaticshape, by which the embodiment is non-limited.

A bottom support projection 145 joined and fixed to the lower elasticmember 160 may be provided to a lower side of the housing 140.

In order to secure a space to be filled with gel type silicon capable ofplaying a damping role as well as to form a path for the support member220 to pass through, the housing may include a first concave recess 142a formed on the second lateral portion 142. Namely, the concave recess142 a of the housing 140 can be filled with the damping silicon.

The housing 140 may include a plurality of third stoppers 149 projectedfrom outer sides of the first lateral portions 141. The third stopper149 is provided to inhibit the housing 140 from colliding with the covermember 300 when the housing 140 moves in the second and thirddirections.

In order to inhibit the lower side of the housing from colliding withthe base 210 and/or the circuit board 250, the housing 140 may furtherinclude a fourth stopper (not shown) projected from a lower surface ofthe housing 140. Through such configuration, the housing 140 is spacedapart from the base 210 in a bottom direction and also spaced apart fromthe cover member 300 in a top direction, thereby enabling an opticaldirection height to be maintained without top/bottom interference.Therefore, the housing 140 can perform optical image stabilization bycontrolling movements in the second and third directions correspondingto a back-forth direction and a right-left direction in the placevertical to the optical axis.

The second magnet 190 and the first magnet 130 (130-1 to 130-4) aredescribed as follows.

The first magnet 130 can be disposed on the second seat portion 141 a ofthe housing 140 so as to overlap with the first coil 120 in a directionvertical to the optical axis.

According to another embodiment, the first and second magnets 130 and190 are disposed on an outer or inner side of the first lateral portion141 or may be disposed on an inner or outer side of the second lateralportion 142 of the housing 140.

According to further embodiment, the second magnet 190 may be receivedinside or outside the first lateral portion 141 of the housing 140.

A shape of the first magnet 130 may include an approximately rectangularshape corresponding to the first lateral portion 141 of the housing 140,and a face confronting the first coil 120 may be formed to correspond toa curvature of a corresponding face of the first coil 120.

The first magnet 130 may be configured as a uni-body. In case of theembodiment, referring to FIG. 5A, a face confronting the first coil 120is disposed to become the S pole 132 and an outer face is disposed tobecome the N pole 134, and vice versa. By this, the embodiment isnon-limited.

At least two first magnets 130 can be disposed in the housing 140. Theembodiment may include 4 first magnets 130-1 to 130-4 disposed on thefirst lateral portions 141 of the housing 140, and each of the 4 firstmagnets 130-1 to 130-4 may be disposed on a corresponding one of the 4first lateral portions of the housing 140. In this case, a plane of eachof the first magnets 130-1 to 130-4, as shown in FIG. 5A, may have anapproximately quadrangular shape or one of a triangular shape and arhombus shape.

In the lens drive unit according to the embodiment, the first coil 120and the first position sensor 170 are disposed on the bobbin 110 and thefirst and second magnets 130 and 190 are disposed on the housing, bywhich the embodiment is non-limited. According to another embodiment,the first coil 120 may be disposed on the housing 140 and the firstmagnet 130 may be disposed on the bobbin 110. Moreover, the firstposition sensor 170 may be disposed on the housing 140 and the secondmagnet 190 may be disposed on the bobbin 110.

The upper elastic member 150, the lower elastic member 160 and thesupport member 220 are described as follows.

The top and lower elastic members 150 and 160 elastically support thebobbin 110. The support member 220 can support the housing 140 to bemovable in a direction vertical to the optical axis with respect to thebase 210 and connect at least one of the top and lower elastic members150 and 160 to the circuit board 250 electrically.

FIG. 10 is an assembled perspective diagram of the upper elastic member150, the lower elastic member 160, the first position sensor 170, thesensor board 180, the base 210, the support member 220 and the circuitboard 250 shown in FIG. 1.

The upper elastic member 150 may include a plurality of upper elasticmembers 150 (150-1 to 150-4) spaced apart from each other by beingelectrically separated from each other. The term ‘upper elastic member’may be referred to as ‘top spring’.

The elastic member contact portions 184-1 to 184-4 of the sensor board180 may be electrically connected to at least one of the top and lowerelastic members 150 and 160.

For example, FIG. 10 shows that the elastic member contact portions184-1 to 184-4 electrically come into contact with the upper elasticmembers 150-1 to 150-4, by which the embodiment is non-limited.According to another embodiment, the elastic member contact portions184-1 to 184-4 may electrically come in contact with the lower elasticmember 160 or both of the top and lower elastic members 150 and 160.

Each of the elastic member contact portions 184-1 to 184-4 of the sensorboard 180, which are electrically connected to the first position sensor170, can be electrically connected to a corresponding one of a pluralityof the upper elastic members 150-1 to 150-4. Each of a plurality of theupper elastic members 150-1 to 150-4 may be electrically connected to acorresponding one of a plurality of the support members 220-1 to 220-4.

Each of the first to fourth upper elastic members 150-1 to 150-4 mayinclude a first inner frame joined to the bobbin 110, a first outerframe joined to the housing 140, and a first frame connecting portionconnecting the inner and outer frames together.

For example, each 150 a of the first and third upper elastic members150-1 and 150-3 may include the first inner frame 151, the first outerframe-1 152 a, and the first frame connecting portion 153.

For example, each 150 b of the second and fourth upper elastic members150-2 and 150-4 may include the first inner frame 151, the first outerframe-2 152 b, and the first frame connecting portion 153.

The first inner frame 151 of each of the first to fourth upper elasticmembers 150-1 to 150-4 may be joined to the bobbin 110, and the innerframe 151 of each of the first to fourth upper elastic members 150-1 to150-4 may be joined to a corresponding one of the elastic member contactportions 184-1 to 184-4 of the sensor board 180 and connected theretoelectrically.

If the upper surface 112 a of the second protrusion 112 of the bobbin110 is flat, as shown in FIG. 4, the first inner frame 151 of the upperelastic member 150 is placed on the upper surface 112 a of the secondprotrusion 112 of the bobbin 110 and then fixed to the upper surface 12a of the second protrusion 112 by an adhesive member.

The first outer frame-1 152 a and the first outer frame-2 152 b may bejoined to the housing 140 and connected to the support member 220. Thefirst frame connecting portion 153 can connect the first inner fame 151to the first outer frame-1 152 a and the first outer frame-2 152 b.

The first outer frame-1 152 a and the first outer frame-2 152 b maydiffer from each other in shape. For example, the first outer frame-2152 b may have a shape of one of 2 equal parts resulting from dividingthe first outer frame-1 152 a into the 2 equal parts, by which theembodiment is non-limited. According to another embodiment, the firstouter frame-1 152 a and the first outer frame-2 152 b may have the sameshape.

According to further embodiment, the first outer frame-1 152 a may bedivided into 2 equal parts, and a shape of one of the 2 equal parts mayhave the same shape of the first outer frame-2 152 b.

The first frame connecting portion 153 can form a pattern in apredetermined shape by being bent once at least. Through a positionchange and fine deformation of the first frame connecting portion 153,an ascending and/or descending operation of the bobbin 110 can beelastically supported in the first direction parallel to the opticalaxis.

The first top support projection 143 of the housing 140 can be joinedand fixed to the first outer frame-1 152 a and the first outer frame-2152 b of the upper elastic member 150 shown in FIG. 10. According to anembodiment, a second perforated hole-2 157 in a shape corresponding to aposition corresponding to the first top support projection 143 may beprovided to each of the first outer frame-1 152 a and the first outerframe-2 152 b. In this case, the first top support projection 143 andthe second perforated hole-2 157 may be fixed to each other bythermosetting or adhesive member such as epoxy, etc.

Through current carrying connections between the elastic member contactportions 184-1 to 184-4 and the first to fourth upper elastic members150-1 to 150-4, the 4 pins P11 to P22 of the first position sensor 170can be electrically connected to the first to fourth upper elasticmembers 150-1 to 150-4.

The first to fourth upper elastic members 150-1 to 150-4 are connectedto the circuit board 250 through the support members 220-1 to 220-4.

The first upper elastic member 150-1 can be electrically connected tothe circuit board 250 through the first support member 220-1. The firstsupport member 220-1 may include a first support member-1 220-1 a and afirst support member-2 220-1 b. At least one of the first supportmember-1 220-1 a and the first support member-2 220-1 b can beelectrically connected to the circuit board 250.

The second upper elastic member 150-2 can be electrically connected tothe circuit board 250 through the second support member 220-2.

The third upper elastic member 150-3 can be electrically connected tothe circuit board 250 through the third support member 220-3. The thirdsupport member 220-3 may include a third support member-1 220-3 a and athird support member-2 220-3 b. At least one of the third supportmember-1 220-3 a and the third support member-2 220-3 b can beelectrically connected to the circuit board 250.

The fourth upper elastic member 150-4 can be electrically connected tothe circuit board 250 through the fourth support member 220-4.

Through two prescribed upper elastic members selected from the first tofourth upper elastic members 150-1 to 150-4 and two prescribed supportmembers selected from the first to fourth support members 220-1 to 220-4connected the selected two prescribed upper elastic members, the firstposition sensor 170 can receive an input signal from the circuit board250.

Through two remaining upper elastic members selected from the first tofourth upper elastic members 150-1 to 150-4 and two remaining supportmembers selected from the first to fourth support members 220-1 to 220-4connected the selected two remaining upper elastic members, the firstposition sensor 170 can output an output signal of the first positionsensor 170 to the circuit board 250.

Meanwhile, the lower elastic member 160 can include first and secondlower elastic members 160-1 and 160-2 spaced apart from each other bybeing electrically separated from each other. The first coil 120 may beelectrically connected to the first and second lower elastic members160-1 and 160-2, and the first and second lower elastic members 160-1and 160-2 can be connected to fifth and sixth support members 220-5 and220-6.

Each of the first and second lower elastic members 160-1 and 160-2 mayinclude at least one second inner frame, at least one second outer frameand at least one second frame connecting portion.

For example, each of the first and second lower elastic members 160-1and 160-2 may include 2 second inner frames 161-1 and 161-2, 2 secondouter frames 162-1 and 162-2, and 3 second frame connecting portions163-1 to 163-3.

The second inner frames 161-1 and 161-2 can be joined to the bobbin 110,and the second outer frames 162-1 and 162-2 can be joined to the housing140.

For example, the second frame connecting portion-1 163-1 connects thesecond inner frame 161-1 and the second outer frame 162-1, the secondframe connecting portion-2 163-2 connects the 2 second outer frames162-1 and 162-2, and the second frame connecting portion-3 connects thesecond inner frame 161-2 and the second outer frame 162-2.

The first lower elastic member 160-1 may further include a first coilframe 164-1, and the second lower elastic member 160-2 may furtherinclude a second coil frame 164-2.

Referring to FIG. 10, each of the first and second coil frames 164-1 and164-2 can be connected to one of both ends of the first coil 120 througha current carrying connecting member such as a solder and the like. Thefirst and second lower elastic members 160-1 and 160-2 receive a drivesignal such as first and second powers of different polarities from thecircuit board 250 and then deliver them to the first coil 120.

Each of the first and second lower elastic members 160-1 and 160-2 mayfurther include a second frame connecting portion-4 163-4. The secondframe connecting portion-4 163-4 can connect the coil frame 164-1 or164-2 to the second inner frame 161-2.

At least one of the second frame connecting portion-1 163-1, the secondframe connecting portion-2 163-2, the second frame connecting portion-3163-3, and the second frame connecting portion-4 163-4 can form apattern in a predetermined shape by being bent at least once.Particularly, through the position changes and fine deformations of thesecond frame connecting portion-1 163-1 and the second frame connectingportion-3 163-3, an ascending and/or descending operation of the bobbin110 in the first direction parallel to the optical axis can beelastically supported.

According to one embodiment, as shown in the drawing, each of the firstand second lower elastic members 160-1 and 160-2 may further include abent portion 165. For example, the bent portion 165 may be connected tothe second outer frame 162. For example, the bent portion 165 may bebent from the second fame connecting portion-2 163-2 toward the upperelastic member 150 in the first direction. For example, the bent portion165 may be connected to a portion at which the second outer frame 162-2and the second frame connecting portion-2 163-2 meet each other.

The upper elastic member 160 may further include fifth and sixth upperelastic members 150-5 and 150-6. The first to sixth upper elasticmembers 150-1 to 150-6 can be separated from each other electrically andspaced apart from each other. The fifth and sixth upper elastic members150-5 and 150-6 can be electrically connected to the circuit boardthrough the fifth and sixth support members 220-5 and 220-6.

Each of the fifth and sixth upper elastic members 150-5 and 150-6 mayinclude a connecting frame 154 joined to the housing 140 and a firstouter frame-3 155 having one end connected to the connecting frame 154and the other end connected to the bent portion 165 of a correspondingone of the first and second lower elastic members 160-1 and 160-2.

The connecting frame 154 of each of the fifth and sixth elastic members150-5 and 150-6 may be connected to the bent portion 165 of acorresponding one of the first and second lower elastic members 160-1and 160-2 and extend in the first direction.

Each of the fifth and sixth elastic members 150-5 and 150-6 may beconnected to the housing 155 by being bent from the connecting frame 154in a direction vertical to the first direction, and connected to acorresponding one of the fifth and sixth support members 220-5 and220-6.

The first outer frame-3 155 of the fifth upper elastic member 150-5 maybe connected to the fifth support member 220-5, and the first outerframe-3 155 of the sixth upper elastic member 150-6 may be connected tothe sixth support member 220-6.

For example, the bent portion 165 of each of the first and second lowerelastic members 160-1 and 160-2, the connecting frame 154 of acorresponding prescribed one of the fifth and sixth elastic members150-5 and 150-6, and the first outer frame 155-3 can be integrallyformed. Thus, each of the first and second lower elastic members 160-1and 160-2 and each of the fifth and sixth elastic members 150-5 and150-6 can have the portions 165 and 154 bent in the first direction,respectively.

Meanwhile, through the fifth and sixth support members 220-5 and 220-6and the fifth and sixth elastic members 150-5 and 150-6 connectedthereto, the first and second lower elastic members 160-1 and 160-2 canreceive a drive signal from the circuit board 250 and then provide thedrive signal to the first coil 120.

In the present embodiment, each of the top and lower elastic members 150and 160 is partitioned. Yet, according to another embodiment, at leastone of the top and lower elastic members 150 and 160 may not bepartitioned.

The first bottom support projection 117 of the bobbin 117 can join andfix the second inner frame 161-1 and 161-2 of the lower elastic member160 and the bobbin 110 to each other.

The second bottom support projection 145 of the housing 140 can join andfix the second outer frame 162-1 and 162-2 of the lower elastic member160 and the housing 140 to each other.

A perforated hole 161 a may be provided to the second inner frame 161-1and 161-2 of each of the first and second lower elastic members 160-1and 160-2. The perforated hole 161 a may be disposed at a locationcorresponding to the first bottom support projection 117 of the bobbin110 and have a shape corresponding to the first bottom supportprojection 117 of the bobbin 110. For example, the first bottom supportprojection 117 of the bobbin 110 and the perforated hole 161 a can befixed to each other by thermosetting or adhesive member such as epoxy,etc.

A perforated hole 162 a may be provided to the second outer frame 162-1and 162-2 of each of the first and second lower elastic members 160-1and 160-2. The perforated hole 162 a may be disposed at a locationcorresponding to the second bottom support projection 145 of the housing140 and have a shape corresponding to the second bottom supportprojection 145 of the housing 140. For example, the second bottomsupport projection 145 of the housing 140 and the perforated hole 162 acan be fixed to each other by thermosetting or adhesive member such asepoxy, etc.

Each of the upper elastic member 150 and the lower elastic member 160may be prepared as a leaf spring, but the embodiment is non-limited bythe material of the upper elastic member 150 and the lower elasticmember 160.

Power is supplied to the first position sensor 170 using theelectrically-separated 2 upper elastic members and 2 support members.And, an output signal outputted from the first position sensor 170 canbe delivered to the circuit board 250 using the electrically-separated 2remaining upper elastic members and 2 remaining support members.

Power can be supplied to the first coil 120 using theelectrically-separated 2 lower elastic members 160-1 and 160-2, theremaining 2 upper elastic members 150-5 and 150-6, and the remaining 2support members 220-5 and 220-6, by which the embodiment is non-limited.

Namely, according to another embodiment, the role of a plurality ofupper elastic members and the role of a plurality of lower elasticmembers may be switched to each other. For example, power can besupplied to the first coil 120 using 2 prescribed upper elastic membersand 2 prescribed support members, power can be supplied to the firstposition sensor 170 using 2 prescribed lower elastic members, and anoutput signal outputted from the first position sensor 170 can bedelivered to the circuit board 250 using 2 remaining prescribed lowerelastic members. This is not shown in the drawing but is obvious throughthe above drawings.

The support member 220 (220-1 to 220-6) is described as follows.

A plurality of the support members 220 may be disposed on the secondlateral portions 142 of the housing 140, respectively. For example, 2support members 220 can be disposed to correspond to each of 4 secondlateral portions 142. The embodiment may include total 8 support members220-1 a, 220-1 b, 220-2, 220-3 a, 220-3 b, 220-4, 220-5 and 220-6, bywhich the embodiment is non-limited.

According to another embodiment, in the housing 140, a single supportmember may be disposed on each of two second lateral portions among 4second lateral portions 142 and 2 support members may be disposed oneach of the 2 remaining second lateral portions 142.

According to another embodiment, the support member 220 may be disposedas a leaf spring on the first lateral portion 141 of the housing 140.

As described above, the support member 220 may form an electrical pathbetween the upper elastic member 150 and the circuit board 250. Forexample, the support member 220 can form a path for delivering a drivesignal and power required by the first position sensor 170 and the firstcoil 120 and a path for providing an output signal outputted from thefirst position sensor 170 to the circuit board 250.

The support member 220 may be embodied by such a member supportive byelasticity as a leaf spring, a coil spring, a suspension wire, etc.Moreover, according to another embodiment, the support member 220 may beintegrally formed with the upper elastic member.

The base 210, the circuit board 250 and the second coil 230 aredescribed as follows.

The base 210 may have a hollow corresponding to a hollow of the bobbin110 or/and a hollow of the housing 140 and be in a shape matching orcorresponding to the cover member 300, e.g., a quadrangular shape.

FIG. 11 is an exploded diagram of the base 210, the second coil 230, thecircuit board 250 and the capacitor 310 shown in FIG. 1.

The base 210 may include a step sill 211 on which an adhesive agent canbe coated when the cover member 300 is adhesively fixed. Here, the stepsill 211 can guide the cover member 300 joined to an upper side and anend portion of the cover member 300 can be joined to the step sill 211by surface contact.

The step sill 211 of the base 210 and the end portion of the covermember 300 may be bonded or fixed to each other by an adhesive agent orthe like.

On a face of the base 210 confronting a portion where a terminal 251 ofthe circuit board 250 is formed, a rack 255 in a corresponding size maybe formed. The rack 255 of the base 210 is formed as a uniform crosssection from an outer side of the base 210 without the step sill 211,thereby supporting a terminal side 253 of the circuit board 250.

A corner of the base 210 may have a second concave recess 212. If thecorner of the cover member 300 has a projected shape, a projectedportion of the cover member 300 can be joined to the base 210 in thesecond concave recess 212.

A seat recess 215-1/215-2 may be provided to an upper side of the base210 so that the second position sensor 240 can be disposed therein.According to an embodiment, 2 seat recesses 215-1 and 215-2 can beprovided to the base 210. As the second position sensor 240 is disposedin the seat recesses 215-1 and 215-2 of the base 210, it is able tosense an extent for the housing 140 to move in the second direction andthe third direction, e.g., a displacement of the housing 140 in thesecond direction and the third direction. For example, in order to sensea displacement of the housing 140 in the second direction and the thirddirection, an angle formed by virtual lines connecting centers of theseat recesses 215-1 and 215-2 of the base 210 to the center of the base210 may include 90 degrees, by which the embodiment is non-limited.

Moreover, a recess 215-3, in which the capacitor 310 is disposed, can beprovided to an upper side of the base 210. For example, in order tofacilitate connection to terminals, the recess 215-3 may be formed on aprescribed region of the upper side of the base 210 adjacent to theterminal side 253 of the circuit board 250.

Each of the seat recesses 215-1 and 215-2 of the base 210 may bedisposed so as to be aligned at or near the center of the second coil230. Or, the center of the second coil 230 may be matched or alignedwith the center of the second position sensor 240.

With reference to the circuit board 250, the second coil 230 may bedisposed at the upper side and the second position sensor 240 and thecapacitor 310 may be disposed at the lower side, by which the embodimentis non-limited. According to another embodiment, at least one of thesecond position sensor 240 and the capacitor 310 may be disposed on thecircuit board 250. Moreover, the capacitor 310 may be formed within thecircuit board 250.

The second position sensor 240 can sense a displacement of the housing140 with respect to the base 210 in a direction (e.g., X-axis or Y-axis)vertical to the optical axis (e.g., Z-axis).

In order to sense a displacement of the housing 140 in a directionvertical to the optical axis, the second position sensor 240 may include2 sensors 240 a and 240 b disposed orthogonal to each other. The firstposition sensor 170 may be referred to as ‘AF (auto focus) positionsensor’, while the second position sensor 240 may be referred to as ‘OIS(optical image stabilizer) position sensor’.

The circuit board 250 may be disposed on the upper side of the base 210and have a hollow corresponding to the hollow of the bobbin 110, thehollow of the housing 140, or/and the hollow of the base 210. A shape ofthe circuit board 250 may include a shape (e.g., a quadrangular shape)matching or corresponding to the upper side of the base 210.

The circuit board 250 may include at least one terminal side 253 onwhich a plurality of terminals 251 or pins for being supplied withelectrical signals externally.

The terminals 251 of the circuit board 250 can be electrically connectedto the second coil 230, the second location sensors 240 a and 240 b, thesupport member 220 and the capacitor 310.

In FIG. 11, the second coil 230 is embodied as prepared to a circuitmember 231 separate from the circuit board 250, by which the embodimentis non-limited. According to another embodiment, the second coil may beembodied by a coil block of a ring type, an FP (fine pattern) coil, or acircuit pattern formed on the circuit board 250.

The second coil 230 may include a through-hole 230 a through the circuitmember 231. The support member 220 can be electrically connected to thecircuit board 250 by passing through the through-hole 2130 a.

The second coil 230 is disposed on the upper side of the circuit board250 so as to confront the first magnet 130 fixed to the housing 140, andconnected to the circuit board 250 electrically.

Total 4 second coils 230 can be installed on 4 sides of the circuitboard 250, by which the embodiment is non-limited. One second coil forthe second direction and one second coil for the third direction can beinstalled. Or, 4 or more second coils may be installed.

For example, each of the 4 second coils 230-1 to 230-4 can beelectrically connected to 2 corresponding terminals among the terminalsof the circuit board 250.

As described above, the housing 140 is moved in the second directionand/or the third direction by interaction between the first magnet 130and the second coil 230 disposed to confront each other, whereby opticalimage stabilization can be performed.

The second position sensor 240 may be provided as a hall sensor andemploy any sensors capable of sensing magnetic field strength. Forexample, the second position sensor 240 may be embodied by a driverincluding a hall sensor, or embodied independently by a positiondetecting sensor such as a hall sensor, etc.

A plurality of the terminals 251 may be installed on the terminal side253 of the circuit board 250. For example, through a plurality of theterminals 251 installed on the terminal side 253 of the circuit board250, external power is received to supply power to the first and secondcoils 120 and 130 and the first and second position sensors 170 and 240and output signals outputted from the first and second position sensors170 and 240 can be outputted externally.

According to an embodiment, the circuit board 250 may be prepared asFPCB, by which the embodiment is non-limited. It is possible to directlyform the terminals of the circuit board 250 on a surface of the base 210using a surface electrode scheme or the like.

The circuit board 250 may include through-holes 250 a 1 and 250 a 2through which the support member 220 can pass. The support member 220can be electrically connected to the corresponding circuit patterndisposed on a lower side of the circuit board 250 through thethrough-holes 250 a 1 and 250 a 2 of the circuit board 250 by solderingand the like. According to another embodiment, the circuit board 250 maynot include the through-holes 250 a 1 and 250 a 2. The support member220 may be electrically connected to the circuit pattern or pad formedon the upper side of the circuit board 250.

The circuit board 250 may further include a through-hole 250 b joined tothe top support projection 217 of the base 210. The top supportprojection 217 of the base 210 and the through-hole 250 b, as shown inFIG. 11, may be fixed to each other by thermosetting or adhesive membersuch as epoxy, etc.

FIG. 12 shows the capacitor 310 mounted on the circuit board 250.

Referring to FIG. 12, the capacitor 310 may be disposed on a first faceof the circuit board 250. For example, the first face of the circuitboard 250 may include a lower side of the circuit board 250 confrontingan upper side of the base 210. For example, the capacitor 310 may bebonded to the lower side of the circuit board 250 and connectedelectrically thereto.

According to another embodiment, the capacitor 310 may be disposed onthe upper side of the circuit board 250.

The capacitor 310 can be disposed or mounted as a chip or condenser onthe circuit board 250, by which the embodiment is non-limited.

According to another embodiment, the first capacitor 310 may be embodiedas included in the circuit board 250. For example, the circuit board 250may include a capacitor consisting of a first conductive layer, a secondconductive layer, and a first insulating layer (e.g., dielectric)disposed between the first and second conductive layers.

The capacitor may be connected in parallel to output ends of the firstposition sensor 170. FIG. 13 is a circuit diagram showing electricalconnection between the capacitor 310 and the first position sensor 170.

Referring to FIG. 13, the first position sensor 170 may include a firstinput terminal 17 a provided with a first input signal Va, a secondinput terminal 17 b provided with a second input signal Vb, a firstoutput terminal 18 a, and a second output terminal 18 b.

The capacitor 310 can be connected in parallel to the first and secondoutput terminals 18 a and 18 b of the first position sensor 170. Namely,one end 305 a of the capacitor 310 can be connected to or access thefirst output terminal 19 a and the other end 305 b of the capacitor 310can be connected to or access the second output terminal 18 b.

The first position sensor 170 may include a resistor (not shown) inside,and the capacitor 310 can for a primary low band pass filter with theresistor in the first position sensor 170, e.g., an RC filter.

A resistance of the internal resistor of the first position sensor 170may range 500 ohm (Ω)˜1000 ohm (Ω), a capacitance of the capacitor 310may range 1 nF˜100 nF, and a cutoff frequency of the primary low bandpass filter consisting of the internal resistor of the first positionsensor 170 and the capacitor 310 may range 1.6 [KHz]˜318.3 [KHz].

Moreover, for example, in order to eliminate PWM noise due to crosstalkbetween the first coil 120 and the first position sensor 170 from theoutput of the first position sensor 170, the capacitance of thecapacitor 310 may range 10 nF 50 nF and the cutoff frequency may range3.19 [KHz]˜31.9 [KHz].

For example, a resistance of the internal resistor of the first positionsensor 170 may be 750 ohm (Ω), a capacitance of the capacitor 310 may be15 F, and a cutoff frequency of the primary low band pass filterconsisting of the internal resistor of the first position sensor 170 andthe capacitor 310 may be about 14 KHz. When a frequency of a PWN signalthat is a drive signal provided to the first coil 120 is 500 KHz (or 1MHz), a gain of the primary low band pass filter may be −31 [dB] (or,−37 [dB].

FIG. 14 shows electrical connection relations between the capacitor 310and terminals of the circuit board 250.

Referring to FIG. 14, by the electrical connection between the elasticmember contact portions 184-1 to 184-4 and the upper elastic member 150,the first and second output terminals 18 a and 18 b of the firstposition sensor 170 can be electrically connected to 2 upper elasticmembers selected from the first to fourth upper elastic members 150-1 to150-4.

Through the electrical connection between the selected 2 upper elasticmembers and the corresponding support members and the electricalconnection between the support members and the circuit board 250, thefirst and second output terminals 18 a and 18 b of the first positionsensor 170 can be electrically connected to 2 terminals (e.g., 251-5 and251-6) among the terminals (e.g., 251-1 to 251-8) of the circuit board250. In FIG. 14, some of the terminals of the circuit board 250 areshown, by which the number of the terminals is non-limited.

The capacitor 310 can be connected in parallel to the 2 terminals (e.g.,251-5 and 251-6) of the circuit board 250 electrically connected to thefirst and second output terminals 18 a and 18 b of the first positionsensor 170.

According to the embodiment, as a low pass filter including thecapacitor 310 connected in parallel to the first and second outputterminals 18 a and 18 b of the first position sensor 170 is configured,PWM noise due to crosstalk between the first coil 120 and the firstposition sensor 170 can be eliminated from the output signal of thefirst position sensor 170, and feedback closed-loop AF performance ofthe first position sensor 170 can be improved by reducing a gain in afrequency region over 1 KHz in audible frequency.

FIG. 15 shows electric connection relations among the first positionsensor 170, the capacitor 310 and the resistor 320 according to anotherembodiment. For the sake of brief description with reference to thedrawings, the same or equivalent components shown in FIG. 13 may beprovided with the same reference numbers, and description thereof willbe repeated schematically or omitted.

Referring to FIG. 15, a lens drive unit according to another embodimentmay further include a resistor 320 connected between the output terminal18 b of the first position sensor 170 and one end 305 b of the capacitor310. The resistor 320 may be disposed or mounted on the circuit board250. According to another embodiment, the resistor 320 may be embodiedas included in the circuit board 250.

By configuring a low band pass filter with the capacitor 310 and theresistor 320, output signals outputted from the output terminals 18 aand 18 b of the first position sensor 170 are filtered through the lowband pass filter. Therefore, PWM noise can be eliminated and feedbackclosed-loop AF performance of the first position sensor 170 can beimproved.

FIG. 16 is an exploded perspective diagram of a camera module 200according to an embodiment.

Referring to FIG. 16, a camera module 200 may include a lens barrel 400,a lens drive unit 100, an adhesive member 612, a filter 610, a firstholder 600, a second holder 800, an image sensor 810, a motion sensor820, an optical image stabilization controller 830, and a connector 840.

The lens barrel 400 may be installed in the bobbin 110 of the lens driveunit 100 and equipped with a lens. According to another embodiment, alens may be directly installed in the bobbin 110.

The first holder 600 may be disposed under the base 210 of the lensdrive unit 100. The filter 610 is installed in the first holder 600.And, the first holder 600 may include a protrusion 500 having the filter610 seated thereon.

By the adhesive member 612, the base 210 of the lens drive unit 100 canbe joined or attached to the first holder 600. The adhesive member 612may play a role in inhibiting particles from entering the lens driveunit 100 as well as an adhesive role.

For example, the adhesive member 612 may include epoxy, thermosettingadhesive, UV-setting adhesive, etc.

By the filter 610, light on a specific frequency band in light passingthrough the lens or the lens barrel 400 can be inhibited from beingincident on the image sensor 810. The filter 610 may include a UV cutofffilter, by which the embodiment is non-limited. Here, the filter 610 maybe disposed parallel to the x-y plane.

A hollow may be formed in a portion of the first holder 600 having thefilter mounted thereon so that light passing through the filter 610 canbe incident on the image sensor 810.

The second holder 800 is disposed under the first holder 600, and theimage sensor 810 can be mounted on the second holder 600. As the lighthaving passed through the filter 610 is incident on the image sensor810, an image included in the incident light is formed in the imagesensor 810.

The second holder 800 may be provided with various circuits, devices, acontroller and the like in order to send the image formed in the imagesensor 810 to an external device by converting the image into anelectrical signal.

The second holder 800 can be embodied by a circuit board. On thiscircuit board, the image sensor can be mounted, a circuit pattern can beformed, and various devices are joined.

The image sensor 810 may receive an image included in the light incidentthrough the lens drive unit 100 and convert the received image into anelectrical signal.

The filter 610 and the image sensor 810 can be disposed by being spacedapart from each other so as to confront each other in the firstdirection.

The motion sensor 820 is mounted on the second holder 800 and can beelectrically connected to the optical image stabilization controller830.

The motion sensor 820 outputs a rotating angular speed informationaccording to motion of the camera module 200. The motion sensor 820 maybe embodied by a 2- or 3-axis gyro sensor or an angular speed sensor.The motion sensor 820 may be configured separatedly from the opticalimage stabilization controller 830, by which the embodiment isnon-limited.

According to another embodiment, the motion sensor 820 may be configuredso as to be included in the optical image stabilization controller 830.

The OIS (optical image stabilization) controller 830 is mounted on thesecond holder 800 and can be electrically connected to the first coil120, the first position sensor 170, the second position sensor 240 andthe second coil 230 of the lens drive unit 100.

For example, the second holder 800 can be electrically connected to thecircuit board 250 of the lens drive unit 100, and the OIS controller 830mounted on the second holder 800 can be electrically connected to thefirst coil 120, the first position sensor 170, the second positionsensor 240 and the second coil 230 via the terminals 251 of the circuitboard.

Based on an output signal provided by the first position sensor 170 ofthe lens drive unit 100, the OIS controller 830 can perform autofocusingon the AF moving unit of the lens drive unit. Based on output signalsprovided by the second position sensor 240 of the lens drive unit 100,the OIS controller 830 can perform optical image stabilization (OIS) onthe OIS moving unit of the lens drive unit 100.

The connector 840 is electrically connected to the second holder 800 andmay have a port so as to be electrically connected to an externaldevice.

FIG. 17 shows one embodiment of connection relations among the first andsecond position sensors 170, 240 a and 240 b, the capacitors 310, 330 aand 330 b and the OIS controller 830 of the camera module 200 shown inFIG. 16.

Referring to FIG. 17, input terminals 17 a and 17 b of the firstposition sensor 170 can be electrically connected to terminals 251-7 and251-8 provided to the circuit board 250 through wirings 30 a and 30 bprovided to the circuit board 250.

Output terminals 18 a and 18 b of the first position sensor 170 can beelectrically connected to terminals 251-5 and 251-6 provided to thecircuit board 250 through wirings 31 a and 31 b provided to the circuitboard 250.

For example, the wirings 30 a and 30 b of the circuit board 250 can beconnected to the support members electrically connected to the upperelastic members connected to the input terminals 17 a and 17 b of thefirst position sensor 170.

For example, the wirings 31 a and 31 b of the circuit board 250 can beconnected to the support members electrically connected to the upperelastic members connected to the output terminals 18 a and 18 b of thefirst position sensor 170.

One end of the capacitor 310 is connected to the wiring 31 a of thecircuit board 250, and the other end can be connected to the wiring 31 bof the circuit board 250.

Description of the capacitance of the capacitor 310, the cutofffrequency of the primary low band pass filter consisting of the internalresistor of the first position sensor and the capacitor 310, and theirfunctions and effects, which are described in FIG. 13, is identicallyapplicable to FIG. 17.

The first OIS position sensor 240 a and the second OIS position sensor240 b may include first and second input terminals 19 a and 19 b and 21a and 21 b and first and second output terminals 20 a and 20 b and 22 aand 22 b, respectively.

The first and second input terminals 19 a and 19 b and 21 a and 21 b ofthe first OIS position sensor 240 a and the second OIS position sensor240 b can be electrically connected to the terminals 251-9 and 251-10and 251-11 and 251-12 of the circuit board 250 through wirings 32 a and32 b and 34 a and 34 b provided to the circuit board 250, respectively.

The terminals 251-9 and 251-10 and 251-11 and 251-12 of the circuitboard 250 can be provided with signals for driving the first OISposition sensor 240 a and the second OIS position sensor 240 b from theOIS controller 830, respectively.

The first OIS position sensor 240 a and the second OIS position sensor240 b may sense strength of a magnetic field according to a motion ofthe housing 140 and output an output signal or a sensing signalaccording to the sensing result to the first and second output terminals20 a and 20 b and 22 a and 22 b, respectively.

The output terminals 20 a and 20 b of the first OIS position sensor 240a can be electrically connected to the terminals 251-1 and 251-2provided to the circuit board 250 through the wirings 33 a and 33 bprovided to the circuit board 250.

The output terminals 22 a and 22 b of the second OIS position sensor 240b can be electrically connected to the terminals 251-3 and 251-4provided to the circuit board 250 through the wirings 335 and 35 bprovided to the circuit board 250.

The lens drive unit 100 according to the embodiment may further includea capacitor 330 a connected in parallel to the output terminals 20 a and20 b of the first OIS position sensor 240 a and a capacitor 330 bconnected in parallel to the output terminals 22 a and 22 b of thesecond OIS position sensor 240 b.

Capacitance of each of the capacitors 330 a and 330 b may range 1 nF˜100nF and a resistance of an internal resistor of each of the first andsecond OIS position sensors may range 500 ohm (Ω)˜1000 ohm (Ω).

And, a cutoff frequency of the primary low band pass filter consistingof the internal resistor of each of the first and second OIS positionsensors and the corresponding capacitor 330 a/330 b may range 1.6[KHz]˜318.3 [KHz].

For example, in order to eliminate PWM noise due to crosstalk betweenthe second coil 230 and the first and second OIS position sensors 240 aand 240 b, the capacitance of the capacitor 330 a/330 b may range 10 nF50 nF and the cutoff frequency may range 3.19 [KHz]˜31.9 [KHz].

PWM noise due to crosstalk between the second coil 230 and the first andsecond OIS position sensors 240 a and 240 b can be eliminated fromoutput signals of the first and second OIS position sensors 240 a and240 b, and feedback closed-loop AF performance of the first and secondOIS position sensors 240 a and 240 b can be improved by reducing a gainin a frequency region over 1 KHz in audible frequency.

For example, one end of the capacitor 330 a can be connected to thewiring 33 a of the circuit board 250, and the other end of the capacitor330 a may be connected to the wiring 33 b of the circuit board 250.

Moreover, for example, one end of the capacitor 330 b can be connectedto the wiring 35 a of the circuit board 250, and the other end of thecapacitor 330 b may be connected to the wiring 35 b of the circuit board250.

Each of the capacitors 330 a and 330 b can be disposed or mounted as achip or condenser on the circuit board 250, by which the embodiment isnon-limited. For example, each of the capacitors 330 a and 330 b may beembodied as included in the circuit board 250. For example, each of thecapacitors 330 a and 330 b may include a capacitor consisting of a firstconductive layer, a second conductive layer, and a first insulatinglayer (e.g., dielectric) disposed between the first and secondconductive layers, which are formed on the circuit board 250.

The OIS controller 830 may include first to third drivers 831-1 to831-3, first to third amplifiers 832-1 to 832-3, a servo controller 825,an OIS driver 843, and an AF driver 836.

The first driver 831-1 provides a drive signal (e.g., a drive power) fordriving the first position sensor 170. For example, the first driver831-1 may provide a drive signal to the terminals 251-7 and 251-8 of thecircuit board 250.

The second driver 831-2 provides a drive signal (e.g., a drive power)for driving the first OIS position sensor 240 a. For example, the seconddriver 831-2 may provide a drive signal to the terminals 251-9 and251-10 of the circuit board 250.

The third driver 831-3 provides a drive signal (e.g., a drive power) fordriving the second OIS position sensor 240 b. For example, the thirddriver 831-3 may provide a drive signal to the terminals 251-11 and251-12 of the circuit board 250.

The first amplifier 832-1 amplifies an output signal of the firstposition sensor 170 and outputs a first amplified signal A1 according tothe amplification result. For example, the first amplifier 832-1 mayinclude first and second input terminals 5 a and 5 b connected to theterminals 251-5 and 251-6 of the circuit board 250 and an outputterminal 6 outputting a first amplified signal A1.

The capacitor 310 may be connected in parallel to the output terminals 5a and 5 b of the first position sensor 170 and the first and secondinput terminals 5 a and 5 b of the first amplifier 832-1.

The second amplifier 832-2 amplifies an output signal of the first OISposition sensor 240 a and outputs a second amplified signal A2 accordingto the amplification result. For example, the second amplifier 832-2 mayinclude first and second input terminals 7 a and 7 b connected to theterminals 251-1 and 251-2 of the circuit board 250 and an outputterminal 8 outputting a second amplified signal A2.

The capacitor 330 a may be connected in parallel to the output terminals20 a and 20 b of the first OIS position sensor 240 a and the first andsecond input terminals 7 a and 7 b of the second amplifier 832-2.

The third amplifier 832-3 amplifies an output signal of the second OISposition sensor 240 b and outputs a third amplified signal A3 accordingto the amplification result. For example, the third amplifier 832-3 mayinclude first and second input terminals 7 c and 7 d connected to theterminals 251-3 and 251-4 of the circuit board 250 and an outputterminal 9 outputting a third amplified signal A3.

For example, each of the first to third amplifiers 832-1 to 832-3 may beembodied by an operational amplifier, by which the embodiment isnon-limited. The first and second input terminals of each of the firstto third amplifiers 832-1 to 832-3 may include an inverting inputterminal and a non-inverting input terminal of the operationalamplifier, by which the embodiment is non-limited.

The capacitor 330 b may be connected in parallel to the output terminals22 a and 22 b of the second OIS position sensor 240 b and the first andsecond input terminals 7 c and 7 d of the third amplifier 832-3.

Based on the first amplified signal A1 and the rotating angular speedinformation SP provided by the motion sensor 820, the servo controller825 outputs a first control signal CT1 for controlling the AF driver834.

Based on the second and third amplified signals A1 and A2 and therotating angular speed information SP provided by the motion sensor 820,the servo controller 825 outputs a second control signal CT2 forcontrolling the OIS driver 836.

Based on the first control signal CT1, the AF driver 834 outputs a firstdrive signal for driving the first coil 120 to an output end. The firstdrive signal may include an AC signal or AC and DC signals. For example,the first drive signal may include a PWM signal and a frequency of thePWM signal may range 0.1 MHz˜10 MHz.

Through wirings 41 and 41 b, the output end of the AF driver 834 maybeelectrically connected to the terminals 251-13 and 251-14 of the circuitboard 250. The wirings 41 a and 41 b may be provided to the secondholder 800 of the camera module 200 in FIG. 16. For example, theterminals 251-13 and 251-14 of the circuit board 250 can be electricallyconnected to the first and second lower elastic members 160-1 and 16-2having the first coil 120 connected thereto.

Based on the second control signal CT2, the OIS driver 836 outputssecond drive signals for driving the first OIS coil 240 a and the secondOIS coil 240 b to an output end.

Each of the second drive signals may include an AC signal or AC and DCsignals. For example, each of the second drive signals may include a PWMsignal and a frequency of the PWM signal may range 0.1 MHz˜10 MHz.

Through wirings 42 a to 42 d, the output end of the OIS driver 836 maybeelectrically connected to the terminals 251-15 to 251-18 of the circuitboard 250.

The wirings 42 a to 42 d may be provided to the second holder 800 of thecamera module 200 in FIG. 16. For example, the terminals 251-15 to251-18 of the circuit board 250 can be electrically connected to thesecond coils 230-1 to 230-4.

In FIG. 16 and FIG. 17, the motion sensor 820 may be embodied separatelyfrom the OIS controller 830, by which the embodiment is non-limited.According to another embodiment, the motion sensor 820 may be embodiedas included in the OIS controller 830.

FIG. 18 is an exploded perspective diagram of a camera module accordingto another embodiment. For the sake of brief description with referenceto the drawings, the same or equivalent components shown in FIG. 16 maybe provided with the same reference numbers, and description thereofwill be repeated schematically or omitted.

Referring to FIG. 18, a camera module 200-1 may have the sameconfiguration of the former camera module 200 shown in FIG. 16 except alens drive unit 100-1 and a filter unit 850. The lens drive unit 100-1of FIG. 19 may have the configuration of the former lens derive unit 100shown in FIG. 1, from which the capacitor 310 is removed.

The camera module 200-1 shown in FIG. 10 may include a filter unit 850disposed on the second holder 800.

The filter unit 850 is disposed on the second holder 800 and may includea capacitor connected in parallel to the first and second outputterminals 18 a and 18 b of the first position sensor 170.

The inner resistor of the first position sensor 170 described in FIG. 13and the capacitor of the filter unit 850 an may configure a primary lowband pass filter, e.g., an RC filter. The description of the capacitanceof the capacitor, the internal resistance of the first position sensor,and the cutoff frequency of the primary low band pass filter isidentically applicable to the filter unit 850 of FIG. 18.

When the first coil 120 is driven with a PWM signal, the filter unit 850can eliminate PWM noise from an output signal of the first positionsensor 170 and is able to feedback closed-loop AF performance of thefirst position sensor 170.

FIG. 19 shows one embodiment of a filter unit shown in FIG. 18.

Referring to FIG. 19, the filter unit 850 may include a capacitor 310 aand a resistor 320 a disposed on the second holder 800.

The resistor 320 a may be mounted on the second holder 800 or embodiedthrough a circuit pattern formed on the second holder 800. For example,one end of the resistor 320 a may be connected to one 18 b of the firstand second output terminals 18 a and 18 b of the first position sensor170, and the other end of the resistor 320 a may be connected to one endof the capacitor 310 a. The capacitor 310 a may be connected to theother end of the resistor 320 a and the other one 18 a of the first andsecond output terminals of the first position sensor 170.

The capacitor 310 a and the resistor 320 a may play a role as a low bandpass filter that filters output signals outputted from the outputterminals 18 a and 18 b of the first position sensor 170.

Or, when an internal resistor exists in the first position sensor 170,the capacitor 310 a, the resistor 320 a and the internal resistor of thefirst position sensor 170 may play a role as a low band pass filter.

Unlike the embodiments shown in FIG. 11 and FIG. 18, the capacitorconnected in parallel to the first and second output terminals 18 a and18 b of the first position sensor 170 may be disposed on the sensorboard 180 shown in FIG. 5C.

For example, the capacitor may be disposed on the second segment 182 bof the body 182 of the sensor board 180 so as to be connected inparallel to the elastic member contact portions (e.g., 184-1, 184-2)connected electrically to the first and second output terminals 18 a and18 b of the first position sensor 170.

Moreover, the capacitor may be embodied as included in the sensor board180. For example, the sensor board 180 may include a capacitorconsisting of a first conductive layer, a second conductive layer, and afirst insulating layer (e.g., dielectric) disposed between the first andsecond conductive layers.

FIG. 20 shows one embodiment of connection relations among the first andsecond position sensors 170, 240 a and 240 b, the capacitors 310′, 330a′ and 330 b′ and the OIS controller 830′ of the camera module 200-1shown in FIG. 18.

The same or equivalent components shown in FIG. 17 may be provided withthe same reference numbers, and description thereof will be repeatedschematically or omitted.

Referring to FIG. 20, first to third drivers 831-1 to 831-3 can beconnected to the terminals 251-7 to 251-12 of the lens drive unit 100-1through wirings 50 a, 50 b, 52 a, 52 b, 54 a and 54 b provided to thesecond holder.

First to third amplifiers 832-1 to 832-3 may be connected to theterminals 251-1 to 251-6 of the circuit board 250 of the lens drive unit110-1 through wirings 51 a, 51 b, 53 a, 53 b, 55 a and 55 b provided tothe second holder 800.

A capacitor 310′ is disposed on the second holder 800 of the cameramodule 200-1 and can be connected in parallel to the terminals 251-5 and251-6 of the circuit board 250 connected to the first and second outputterminals 18 a and 18 b of the first position sensor 170 and the firstand second input terminals 5 a and 5 b of the first amplifier 832-1.

For example, one end of the capacitor 310′ is connected to the wiring 51a of the second holder 800 and the other end of the capacitor 310′ canbe connected to the wiring 51 b of the second holder 800.

The capacitor 330 a′ is disposed on the second holder 800 of the cameramodule 200-1, and can be connected in parallel to the terminals 251-1and 251-2 of the circuit board 250 connected to the first and secondoutput terminals 20 a and 20 b of the first OIS position sensor 240 aand the first and second input terminals 7 a and 7 b of the secondamplifier 832-2.

For example, one end of the capacitor 330 a′ is connected to the wiring53 a of the second holder 800 and the other end of the capacitor 330 a′can be connected to the wiring 53 b of the second holder 800.

The capacitor 330 b′ is disposed on the second holder 800 of the cameramodule 200-1, and can be connected in parallel to the terminals 251-3and 251-4 of the circuit board 250 connected to the first and secondoutput terminals 22 a and 22 b of the second OIS position sensor 240 band the first and second input terminals 7 c and 7 d of the thirdamplifier 832-3.

For example, one end of the capacitor 330 b′ is connected to the wiring55 a of the second holder 800 and the other end of the capacitor 330 b′can be connected to the wiring 55 b of the second holder 800.

FIG. 21 is a block diagram of the image sensor 810 shown in FIG. 16 andFIG. 18 according to one embodiment.

Referring to FIG. 21, an image sensor 100 includes a sensing controller905, a pixel array 910 and an analog-digital converting block 920.

The sensing controller 905 outputs control signals (e.g., reset signalRX, transmitted signal TX, and selection signal SX) for controllingtransistors included in the pixel array 910 and control signals Sc forcontrolling the analog-digital converting block 130.

The pixel array 910 includes a plurality of unit pixels P11 to Pnm (n:natural number>1, m: natural number>1), and a plurality of the unitpixels P11 to Pnm can be arrayed to have a matrix form consisting ofrows and columns. Each of the unit pixels P11 to Pnm may include aphotoelectric transformation element that senses light to transform intoan electrical signal.

The pixel array 120 may include sensing lines connected to output endsof a plurality of the unit pixels P11 to Pnm.

For example, each of the unit pixels P11 to Pnm may include aphotodiode, a transfer transistor, a reset transistor, a drivetransistor and a select transistor, by which the embodiment isnon-limited. The number of transistors included in the unit pixel is notlimited to 4 and may be 3 or 5.

The photodiode absorbs light and generates electric charge by theabsorbed light.

The transfer transistor can send electric charge generated by thephotodiode to a sensing node (e.g., a floating diffusion region) inresponse to a transmitted signal TX. The reset transistor may reset aunit pixel in response to a reset signal RX. The drive transistor may becontrolled in response to a voltage of the sensing node, embodied by asource follower, and play a role as a buffer. The select transistor maybe controlled by a selection signal SE and output a sensing signal Va toan output terminal of the unit pixel.

The analog-digital converting block 920 samples the sensing signal VAthat is an analog signal outputted from the pixel array 910 and thenconverts the sampled sensing signal into a digital signal Ds. Theanalog-digital converting block 920 can perform correlated doublesampling (CDS) to eliminate fixed pattern noise unique to a pixel.

The sensing controller 905 and the analog-digital converting block 920may be embodies separately from the OIS controller 830, by which theembodiment is non-limited. The sensing controller 905, theanalog-digital converting block 920 and the OIS controller 830 may beembodied by a single controller.

FIG. 22 is a perspective diagram of a portable terminal 200A accordingto an embodiment. FIG. 23 is a configurational diagram of the portableterminal shown in FIG. 22.

Referring to FIG. 22 and FIG. 23, a portable terminal 200A (hereinaftercalled ‘terminal’) may include a body 850, a wireless communication unit710, an A/V input unit 720, a sensing unit 740, an input/output unit750, a memory unit 760, an interface unit 770, a controller 780 and apower supply unit 790.

The body 850 shown in FIG. 22 is a bar type, by which the embodiment isnon-limited. The body 850 may include one of various structures such asa slide type, a folder type, a swing type, a swivel type and the lie, inwhich two or more sub-bodies are slidably joined to each other.

The body 850 may include a case (e.g., casing, housing, cover, etc.).For example, the body 850 may be divided into a front case 851 and arear case 852. In a space formed between the front and rear cases 851and 852, various electronic parts of the terminal can be built.

The wireless communication unit 710 can be configured by including atleast one module capable of wireless communication between the terminal200A and a wireless communication system or between the terminal 200Aand a network on which the terminal 200A is located. For example, thewireless communication unit 710 may include a broadcast receiving module711, a mobile communication module 712, a wireless internet module 713,a short range communication module 714 and a location information module715.

The A/V (audio/video) input unit 720 is provided for an audio or videosignal input and may include a camera 721, a microphone 722, etc.

The camera 721 may include the camera module 200/200-1 according to theembodiment shown in FIG. 16/FIG. 17.

The sensing unit 740 senses such a current state of the terminal 200A asan open/closed state of the terminal 200A, a location of the terminal200A, a presence or non-presence of contact with a user, a bearing ofthe terminal 200A, acceleration/deceleration of the terminal 200A, andthe like, and is then able to generate a sensing signal for controllingan operation of the terminal 200A. For example, if the terminal 200A isa slide phone type, the sensing unit 740 can sense whether the slidephone is open or closed. And, the sensing unit 740 is responsible for asensing function related to a presence or non-presence of a power supplyof the power supply unit 790, a presence or non-presence of a connectionbetween the interface unit 770 and an external device, etc.

The input/output unit 750 is provided to generate an input or outputrelated to visual sense, auditory sense, tactile sense or the like. Theinput/output unit 750 can generate input data for an operation controlof the terminal 200A and display information processed by the terminal200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, an audio output module 752 and a touchscreen panel 753. Thekeypad unit 730 may generate input data according to a keypad input.

The display module 751 may include a plurality of pixels changing incolor according to an electric signal. For example, the display module751 may include at least one of a liquid crystal display, a thin filmtransistor-liquid crystal display, an organic light-emitting diode, aflexible display, and a 3D display.

The audio output module 752 may output audio data received from thewireless communication unit 710 in a call signal receiving mode, a callmode, a recording mode, a voice recognition mode, a broadcast receivingmode, etc., or output audio data stored in the memory unit 760.

The touchscreen panel 753 can transform variation of electrostaticcapacitance generated according to a user's touch to a specific regionof a touchscreen into an electrical input signal.

The memory unit 760 may store programs for processing and control of thecontroller 780 and temporarily store inputted/outputted data (e.g.,phonebook, message, audio, still image, photo, video, etc.). Forexample, the memory unit 760 may store images (e.g., photos, videos,etc.) captured by the camera 721.

The interface unit 770 plays a role as a passage connected to anexternal device connected to the terminal 200A. The interface unit 770receives data from an external device or is supplied with a power andthen delivers the received data or the supplied power to the respectivecomponents in the terminal 200A. And, the interface unit 770 enablesdata inside the terminal 200A to be transmitted to the external device.For example, the interface unit 770 may include a wired/wireless headsetport, an external charger port, a wired/wireless data port, a memorycard port, a port connecting an identification module provided device,an audio I/O (input/output) port, a video I/O (input/output) port, anearphone port, etc.

The controller 180 can control overall operations of the terminal 200A.For example, the controller 780 can perform the control and processingrelevant to voice call, data communication, video call and the like.

The controller 780 may have a multimedia module 781 for multimediaplayback. The multimedia module 781 may be embodied within or separatelyfrom the controller 780.

The controller 780 may include a display controller 781A generatingdisplay control signals for driving the display unit 751 and a cameracontroller 782 generating camera control signals for driving the camera721.

The controller 780 may perform pattern recognition processing forrecognizing a handwriting/picture-drawing input applied to thetouchscreen as a text/image.

The power supply unit 790 receives an external or internal power underthe control of the controller 780 and is then able to supply a powernecessary for an operation of each component.

The features, structures, effects and the like described in the aboveembodiments are included in at least one embodiment of the presentinvention and should be non-limited to one embodiment only. Thefeatures, structures, effects and the like exampled in one embodimentcan be combined or modified by those skilled in the art for otherembodiments. It will be appreciated by those skilled in the art thatvarious combinations and modifications can be made in the presentinvention without departing from the spirit or scope of the inventions.

INDUSTRIAL APPLICABILITY

The embodiment is applicable to a lens drive unit, camera module andoptical instrument, by which noise due to crosstalk with a first coil iseliminated as well as feedback closed-loop performance of a firstposition sensor is improved.

1. A camera module comprising: a lens barrel; a lens drive unit formoving the lens barrel; a first circuit board electrically connected tolens drive unit; an image sensor disposed on the first circuit board;and a first capacitor disposed on the first circuit board, wherein thelens drive unit comprises: a housing; a bobbin disposed in the housing;a first coil disposed on the bobbin; a first magnet disposed on thehousing; a first position sensor disposed on the housing and comprisingfirst and second input terminals and first and second output terminals;an upper elastic member coupled to an upper portion of the bobbin and anupper portion of the housing; a second circuit board disposed under thehousing; a second coil disposed on the second circuit board and facingthe first magnet; and a support member electrically connecting thesecond circuit board and the upper elastic member, wherein the upperelastic member comprises a first upper elastic member electricallyconnected to the first input terminal, a second upper elastic memberelectrically connected to the second input terminal, a third upperelastic member electrically connected to the first output terminal, anda fourth upper elastic member electrically connected to the secondoutput terminal, wherein one end of the first capacitor is electricallyconnected to the third upper elastic member and another end of the firstcapacitor is electrically connected to the fourth upper elastic member.2. The camera module of claim 1, wherein the support member comprises afirst wire coupled to the first upper elastic member and a second wirecoupled to the second upper elastic member, wherein one end of the firstcapacitor is electrically connected to the first wire and another end ofthe first capacitor is electrically connected to the second wire.
 3. Thecamera module of claim 2, wherein the second circuit board comprises afirst terminal electrically connected to the first wire and the secondterminal electrically connected to the second wire.
 4. The camera moduleof claim 3, wherein one end of the first capacitor is electricallyconnected to the first terminal of the second circuit board and anotherend of the first capacitor is electrically connected to the secondterminal of the second circuit board.
 5. The camera module of claim 1,wherein the first capacitor is connected in parallel to the first andsecond output terminals of the first position sensor.
 6. The cameramodule of claim 1, wherein the first elastic member electricallyconnects the first output terminal of the first position sensor and thefirst wire, and the second elastic member electrically connects thesecond output terminal of the first position sensor and the second wire.7. The camera module of claim 2, wherein the upper elastic membercomprises a third upper elastic member electrically connected to thefirst input terminal of the first position sensor and a fourth upperelastic member electrically connected to the second input terminal ofthe first position sensor.
 8. The camera module of claim 7, wherein thesupport member comprises a third wire electrically connected to thethird upper elastic member and a fourth wire electrically connected tothe fourth upper elastic member.
 9. The camera module of claim 1,wherein capacitance of the first capacitor is 10 nF˜50 nF.
 10. Thecamera module of claim 1, wherein the second coil comprises a circuitmember disposed under the second circuit board and coil units formed atthe circuit member.
 11. The camera module of claim 1, comprising: a basedisposed under the second circuit board; and a second position sensordisposed between the second circuit board and the base, wherein thesecond position sensor is configured to sense strength of a magneticfield of the first magnet according to a movement of the housing. 12.The camera module of claim 1, comprising a second magnet disposed on thebobbin, and wherein the first position sensor is disposed on thehousing.
 13. The camera module of claim 1, wherein the first positionsensor includes an internal resistor, and wherein resistance of theinternal resistor of the first position sensor is 500 ohm (Ω)˜1000 ohm(Ω).
 14. The camera module of claim 1, comprising a lower elastic membercoupled to a lower portion of the bobbin and a lower portion of thehousing.
 15. The camera module of claim 1, comprising fifth and sixthupper elastic members electrically connected to the first coil.
 16. Thecamera module of claim 15, wherein the support member comprises a fifthwire electrically connecting the fifth upper elastic member and a sixthwire electrically connecting the sixth upper elastic member.
 17. Thecamera module of claim 1, wherein the first magnet comprises four magnetunits, and the second coil comprises four coil units corresponding tothe four magnet units.
 18. The camera module of claim 11, comprising asecond capacitor disposed on the first circuit board, wherein the secondposition sensor comprises first and second output terminals, and whereinthe second capacitor is connected in parallel to the first and secondoutput terminals of the second position sensor.
 19. A camera modulecomprising: a lens barrel; a lens drive unit for moving the lens barrel;a first circuit board electrically connected to lens drive unit; animage sensor disposed on the first circuit board; and a capacitordisposed on the first circuit board, wherein the lens drive unitcomprises: a housing; a bobbin disposed in the housing; a first coildisposed on the bobbin; a first magnet disposed on the housing; a firstposition sensor disposed on the housing and comprising first and secondinput terminals and first and second output terminals; an upper elasticmember coupled to an upper portion of the bobbin and an upper portion ofthe housing and comprising a first upper elastic member coupled to thefirst output terminal of the first position sensor and a second upperelastic member coupled to the second output terminal of the firstposition sensor; a second circuit board disposed under the housing andcomprising first and second terminals electrically connected to thefirst circuit board; a second coil disposed on the second circuit boardand facing the first magnet; and a support member comprises a first wirecoupled to the first upper elastic member and a second wire coupled tothe second upper elastic member, wherein the first terminal of thesecond circuit board is electrically connected to the first wire and thesecond terminal of the second circuit board is electrically connected tothe second wire, and wherein one end of the capacitor is electricallyconnected to the first terminal of the second circuit board, and anotherend of the capacitor is electrically connected to the second terminal ofthe second circuit board.
 20. A phone comprising: a display moduleincluding a plurality of pixels; and the camera module according toclaim 1.